OS-251 Solder Stripper and Copper Brightener is the renewable second step in the two-step, non-peroxide, solder stripping process. The two-step process eliminates problems typically associated with peroxide-based solder strippers such as exotherm, attack on exposed laminate, generation of acid fumes and mists, and difficult waste treatment. OS-251 is non-chelated and free from fluorides so it can be readily waste treated by simple hydroxide precipitation methods.
OS-993* Soldermask Remover is an aqueous, alkaline liquid designed to remove fully cured dry film soldermask and photoimageable soldermasks from printed circuit boards. OS-993* is very effective on some of the newer masks that are more difficult to strip. It can also completely remove soldermask without needing to mechanically scrub the boards following immersion in OS-993*. OS-993* removes soldermask with much shorter exposure time than most competitive products. Soldermask is removed without damaging the circuitry or epoxy laminate.
HARAJ65BR is a medium to high viscosity water-soluble flux formulated expressly for vertical hot air leveling systems, both manual and automatic. The viscosity is controlled to minimize de-wetting on surface mount pads and is formulated to insure first pass coverage on even difficult boards. HARAJ65BR provides optimal coverage on solder mask defined pads. There are also additives to this flux to minimize bridging on fine pitch surface mount pads. This flux is also especially suited for flat finishes on surface mount pads.
Leveraging their understanding of material behavior, Florida CirTech technologists recognized the need for a protective and durable, hydrophobic SMT stencil coating, especially as electronic device dimensions were becoming increasingly miniaturized and solder paste transfer efficiency more challenging. The result was the development of NanoSlic.
AT 200 Copper Anti-Tarnish protects copper and copper alloys from tarnishing by forming a corrosion resistant film on their surface. This film will also protect silver from tarnishing for short periods of time. The additives in AT 200 Copper Anti-Tarnish will tie up copper ions loosely preventing them from immersion on other metals such as aluminum and steel.
TAS 100 is a blend of acid salts, activators and surfactants which can be used as a replacement for liquid acids in many applications. TAS 100 solutions are suitable to be used as activating dips prior to plating on iron, steel, brass, copper or zinc die castings. The addition of these activators in this blend assures brighter, cleaner surfaces, thereby giving better adhesion and faster, more uniform bright plating. The careful blending of TAS 100 produces a product with high residual acidity assuring a stable acidity over a long period regardless of the amount of work processed. This is unlike solutions made from mineral acids which vary in pH as they are used.
ZS 100 is a mildly acidic zincate strip powder that is used to remove zincate coatings in metal finishing applications. ZS 100 is typically used between the first and second zincate coating steps. Striping and applying a second zincate coating enhances adhesion of the coating. ZS 100 is a powder product which allows the user to control the concentration as desired. ZS 100 powder is stable indefinitely and does not loose active oxygen like liquid microetch products.
EZ Bond 100 ZINCATE is an electroless process for aluminum which is used to prepare aluminum for electroplating. It enables many different electro-deposits to be applied directly without brass or copper strike plate. EZ Bond 100 ZINCATE creates a dull-gray zinc alloy on aluminum or its alloys. The solution is easy to control and economical to use while exhibiting excellent adhesion and corrosion resistance.