HO351 is a specially formulated chemical used for fusing and leveling solder-plated printed circuit boards by immersion reflow technique. HO351 FUSISNG FLUX serves as a tarnish remover and prevents oxidation during reflow. It also does not splatter and has significantly reduced flammability hazards compared to alcohol-based fluxes.
HO 351 Hot Oil Flux
Description
HO351 is a specially formulated chemical used for fusing and leveling solder-plated printed circuit boards by immersion reflow technique. HO351 FUSISNG FLUX serves as a tarnish remover and prevents oxidation during reflow. It also does not splatter and has significantly reduced flammability hazards compared to alcohol-based fluxes.
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Processing Guide
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