AC-178 is a post-catalyst solution designed to accelerate the electroless copper coverage on catalyzed material. It has been designed to help dissolve the hydroxide tin complex, which was produced in the rinse steps following activator CT-164. AC-178 will remove excess tin hydroxide from the copper surface thereby aiding in the adhesion of electroless copper to the copper foil.
AC-178 Accelerator Solution
Description
AC-178 is a post-catalyst solution designed to accelerate the electroless copper coverage on catalyzed material. It has been designed to help dissolve the hydroxide tin complex, which was produced in the rinse steps following activator CT-164. AC-178 will remove excess tin hydroxide from the copper surface thereby aiding in the adhesion of electroless copper to the copper foil.
Related products
EZ7000 Solder Stripper
OS-611 Reflow Flux
Processing Guide
TS-28 Immersion White Tin