OS-201 SOLDER STRIPPER is the first step in the two-step solder stripping process to prepare solder mask over bare copper (SMOBC) printed circuit boards. OS-201 contains no peroxide, no fluorides, and no chelating agents to complicate waste treatment. Little or no heat is generated by OS-201, so exposed laminate and copper circuitry is not at risk of damage from strong exothermic reactions typical of peroxide-based solder strippers. OS-201 dissolves both tin and lead resulting in less sludging in the bath than most one-step solder strippers. OS-201 provides long bath life and low-use cost.