Products

NS41 is a nickel stripper concentrate. This is used in combination with stabilized hydrogen peroxide, Cir130A, to strip nickel metal from copper substrates. NS41 gives very little copper attack. The NS41 process leaves the copper bright and shiny and ready for further processing. NS41 is used for electroless and electrolytically plated nickel. NS41 will not strip gold. Gold stripping must be done prior to nickel stripping, when necessary.

NS-41 TDS

The ENIG IG300 Immersion Gold solution is specially formulated to deposit immersion gold over electroless nickel on printed circuit boards. This is the last step of the ENIG process designed to produce a solderable finish. The gold deposit produced is 2 – 4 microinches (0.05 – 0.10 microns) thick.

IG-300 TDS

The ENIG EN300 Electroless Nickel bath deposits a uniform layer of nickel metal with a medium phosphorous content. This electroless nickel bath is specially formulated to plate nickel only onto copper surfaces. Skip plating, background plating, and “black pad” are not a concern with this solution.

EN-300 TDS

The ENIG CT300 Catalyst is a key step in the Electroless Nickel Immersion Gold process. It is a palladium activator that catalyzes the copper surface enabling electroless nickel deposition. Use of a pre- dip is required before the palladium activator step. The pre-dip protects and limits drag-in to the activator bath. Use of an acid post dip is also required after the activator.

CT-300 TDS

PC-5012 is a highly concentrated, acidic, liquid concentrate which is use to clean copper clad laminate prior to the pattern plating process. It contains a concentrated blend of acids and surfactants developed and designed to remove and dissolve surface films normally found during pattern plating. It contains no ammonia, chelators or solvents. PC-5012 does not contain alkyl phenol type surfactants.

PC-5012 TDS

IS175 is a highly effective anti-tarnish for immersion silver. This solution coats the silver with an invisible tarnish inhibiting layer. Anti-tarnish coated silver exhibits good solderability. This bath can be run as the last step of an immersion silver process. If the immersion silver coating is tarnished, then the tarnish should be removed before application of this antitarnish.

IS-175 TDS

This is an Immersion Silver process that can be used as a direct replacement for the hot air solder leveling process. It covers all copper surfaces with a very dense metallic silver deposit that retains its solderability for over one year. This process will always produce a flat solderable surface that is desirable for surface mount components. The coating is uniform over the whole copper area.

IS-150 TDS

CirEtch 130 is an easy to use, stabilized, hydrogen peroxide/sulfuric acid, copper micro etch. It has been designed to be used in the printed circuit industry. It can be used to increase the surface bonding of copper to copper, preventing poor adhesion of copper and blisters and peelers. It’s varied etching characteristic makes it an excellent etchant for the pre-plate line as well as for the pattern plating line. CirEtch 130 is ideal for use with many final finishes, such as immersion silver, ENIG, and immersion tin. Cir130 produces the proper surface topography to enhance solderability.

CIR-130 TDS