ENIG EN300 Electroless Nickel

ENIG EN300 Electroless Nickel

The ENIG EN300 Electroless Nickel bath deposits a uniform layer of nickel metal with a medium phosphorous content. This electroless nickel bath is specially formulated to plate nickel only onto copper surfaces. Skip plating, background plating, and “black pad” are not a concern with this solution.

EN-300 TDS

Category: PCB Fabrication Chemicals
Sub-Category: Final Finishes