EB-660 is a post-etch back neutralizer solution designed to neutralize and clean permanganate residue out of the holes of printed circuit boards. It insures a well-conditioned hole wall surface that allows for subsequent electroless copper coverage.
EB-613 is an epoxy etch compound that is used to clear multilayer printed circuit broads of drilling residue prior to electroless copper coverage. It will promote good adhesion of electroless copper and direct metallization coating to the epoxy. It is part of a three part cleaning cycle; EB-610, EB-613 and EB-660. If properly used, it can produce etch back depths of 0.2 to 0.4 mil.
EB-610 is a water soluble, liquid solvent blend that is used to condition epoxy material. When used prior to permanganate etch back it helps to accelerate the action of the etch. It can also be used after sulfuric acid etch back to aide in the adhesion of electroless copper deposition. Its cleans the hole wall surfaces from debris allowing for maximum adhesion of the copper.
OS-108 Screen Cleaner is a non glycol ether, non chlorinated, free rinsing, slow evaporating, mild odor cleaner formulated to remove uncured soldermask, uncured legend ink, and uncured primary image ink from screens and parts. OS-108 is non corrosive to aluminum screen chases and is safe for use on stainless steel and polyester screen fabric.
OS-105 Screen Cleaner is a non chlorinated water soluble, slow evaporating, mild odor cleaner formulated to remove uncured solder mask, uncured legend ink and uncured primary image ink from screens and parts. OS-105 is non corrosive to aluminum screen chases and is safe for use on stainless steel and polyester screen fabric.
OS-452 Spray Equipment Cleaner is a concentrated solution designed to clean and condition spray developing, etching, and stripping equipment. OS-452 effectively removes machine foulants such as dry film photoresist, etchant residues, and water hardness scale thereby restoring equipment to maximum efficiency. OS-452 is a chelated product. If a non-chelated product is required, use OS-494 Non-Chelated Equipment Cleaner.
For pre-cleaning prior to hot air leveling. Excellent removal of fingerprints, shop soils, and oxides. Provides ideal surface for molten solder adhesion. Non-chelated. Easy to waste treat.
OS-331 TDS