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SS1AB Solder Stripper

SS-A/B Solder Stripper is specifically designed for solder and tin stripping applications. SS-A is to be used in conjunction with SS-B for the first part in a two stage solder stripper. The two parts of this stripper are separate to maximize stability and ensure a long shelf life. It contains no complex fluorides thus avoiding the possibility of solution exotherming, and will not attack laminate. SS-A/B strips rapidly and stops at the intermetallic layer between the solder and copper therefore allowing the board to remain in the stripping solution without being damaged. The intermetallic layer is removed quickly using SS2 copper conditioner or EZ 6001 Solder stripper.

SS1AB TDS

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AT-701 Copper Anti-Tarnish

AT-701 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide a temporary tarnish protection for copper. The AT-701 product has been formulated to remove light copper oxides and leave behind a chemically bonded anti-tarnish organic film. This clean protective surface will allow better bonding of dry film and other photo resists to the copper surface. The treated surface will prevent surface oxidation, tarnishing and staining. AT-701 does not contain any chromates or waxes, and can easily be removed with a mild surface etch.

AT-701 TDS

EC-74 Electroless Copper

EC-74 is a versatile electroless copper process that has been engineered for today’s sophisticated circuit boards. EC-74 is formulated to provide a substantial, fine grained structured copper film. EC-74 is formulated to provide a deposit having uniform physical properties ideal for high performance multilayer manufacturing and processing of all resists.

EC-74A TDS

EC-200 Electroless Copper

Excelplate EC-200 is specially formulated to plate 0.25 microns (10 millionths of an inch) of copper in 10 minutes. This bath is highly stable, easy to replenish and run, and does not plate out during periods of inactivity. It is especially suitable as a low deposit copper for printed circuit board that will be flash electroplated. EC-200 is also recommended for plating of ceramics, as the conductive copper film serves as an excellent base for further electroplating.

EC-200 TDS

CT-164 Catalyst

CT-164 is an important part of activation of printed circuit boards. It is a single step, low acid catalyst designed to be used in the electronic industry as an activator for non active surfaces that will promote electroless copper coverage. CT-164 contains a balanced blend of acidic chloride compounds which helps to prevent the attack of black oxide inner layers. It is the ideal activator for multi-layered activation.

CT-164 TDS

PD-140C Pre-Dip Crystals

PD-140C is an acidic crystal compound that is used to make up a working PD-140 solution. It is an important part of the activation of printed circuit boards. PD-140 is supplied either in a dry or liquid form. It is designed to be used prior to the CT-164 activator. It protects the activator solution from contamination and normality imbalance. PD-140 contains a special blend of acidic compounds that help it increase the coating’s deposit energy. It pre-conditions the epoxy fiberglass allowing for the proper absorption of the catalyst solution. PD-140C is supplied as dry salt crystals, which allow for easy make up of the working solution.

PD-140C TDS

AC-177 Accelerator Solution

AC-177 is a non-fluoride post-catalyst solution designed to accelerate the electroless copper coverage on catalyzed material. It has been designed to dissolve the hydroxide tin complex produced in the rinse steps following activator CT-164. AC-177 will remove excess tin hydroxide from the copper surface thereby aiding in the adhesion of electroless copper to the copper foil. Used prior to the electroless copper, AC-177 will help prevent the accidental drag in of catalyst into the electroless copper bath, and help increase its stability.

AC-177 TDS

CC-110 Cleaner/Conditioner

CC-110 contains a concentrated blend of surfactants and wetting agents that has designed to clean the copper foil surface prior to the electroless copper deposition. CC-110 has been formulated to remove fingerprints and light oils from copper foil. It contains conditioning agents that activate glass fibers and epoxy, allowing for a reliable absorption of the catalyst. CC-110 has been designed so it can be easily rinsed from the copper surface with cold tap water.

CC-110 TDS

CC-108 Cleaner/Conditioner

CC-108 contains a concentrated blend of surfactants and wetting agents that has designed to clean the copper foil surface prior to the electroless copper deposition. CC-108 has been formulated to remove fingerprints and light oils from copper foil. It contains conditioning agents which activate glass fibers and epoxy, allowing for a reliable absorption of the catalyst. CC-108 has been designed so it can be easily removed from the copper surface with cold tap water.

CC-108 TDS

GE-77 Multilayer Glass Etch

GE-77 is an acidic, dry crystalline powder which is use to frost and etch glass fibers found exposed after the multilayer etch back cycle. It contains a concentrated blend of fluorides developed and designed to ensure removal of debris and promote good adhesion of electroless copper or other conductive coatings. GE-77 is used after the panels have been etched back and prior to the PTH line. It can also be used to remove drilling debris sometimes left embedded on the slots and holes of printed circuit boards.

GE-77 TDS

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