EC-74 Electroless Copper
EC-74 Electroless Copper
EC-74 is a versatile electroless copper process that has been engineered for today’s sophisticated circuit boards. EC-74 is formulated to provide a substantial, fine grained structured copper film. EC-74 is formulated to provide a deposit having uniform physical properties ideal for high performance multilayer manufacturing and processing of all resists.
Category: PCB Fabrication Chemicals
Sub-Category: Electroless Copper