OS-973* Dry Film Solder Mask Remover is an alkaline liquid designed to remove fully cured dry film solder mask and most photoimageable solder masks from printed circuit boards. OS-973* removes solder mask with much less exposure time than most competitive products. The solder mask is removed without damage to the circuitry or to the epoxy laminate.
OS-993* Soldermask Remover is an aqueous, alkaline liquid designed to remove fully cured dry film soldermask and photoimageable soldermasks from printed circuit boards. OS-993* is very effective on some of the newer masks that are more difficult to strip. It can also completely remove soldermask without needing to mechanically scrub the boards following immersion in OS-993*. OS-993* removes soldermask with much shorter exposure time than most competitive products. Soldermask is removed without damaging the circuitry or epoxy laminate.
Removes solder masks from epoxy or polyimide based printed circuit boards without damaging the circuitry or the laminate.
OS-995 TDS
OS-953 LPI/Dry Film Solder Mask Remover is an aqueous, alkaline liquid designed to remove fully cured dry film solder mask and most photoimageable solder masks from printed circuit boards. OS-953 removes solder mask with much shorter exposure time than most competitive products. Solder mask is removed without damaging the circuitry or epoxy laminate.
RS-3150 Resist Stripper is a solution formulated to strip semi-aqueous dry film photo-resist and alkaline soluble screen printing inks. RS3150 contains copper brightening agents for a uniform clean copper appearance. RS-3150 has excellent stripping capacity and a rapid strip rate for high-speed horizontal applications. RS3150 can also be used in a batch mode. As
RS-3150 becomes saturated with resist; it may become necessary to add a suitable de-foamer such as BB-300.
In addition, RS-3150 can also be used as a fully cured solder mask remover. RS-3150 will not attack the butter coat or the metals of the printed circuit board. Concentration and temperature should be adjusted according to technical data sheet.
