Final Finishes

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TS-28 Immersion White Tin

TS28 is specially engineered “Immersion White Tin” processes that can be used as a direct replacement for the hot air solder leveling process. It will cover active copper surfaces with a very dense white tin that retains its solderability in excess of one year. The key to the process is the type and structure of the deposit. It is a fine crystalline structure that is non-porous.

The TS28 process consists of two proprietary products. The first is TS14, a pre dip solution that activates the copper surface. This ensures that the subsequent step, TS28, will chemically deposit the correct structure of white tin.

TS-28 TDS

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TS-14 Immersion Tin Pre Dip

The TS Immersion Tin process is a lead-free replacement for the hot air leveling process. It covers the copper surface with a specialized-engineered immersion white tin metal that retains solderability through multiple assembly cycles.

TS14 is an important part of the TS immersion coating process. It is designed to be used as a pre-dip to the TS28 Immersion Tin solution. It protects the tin solution from contamination and normality imbalance. TS14 contains a special blend of acidic and organic compounds that control the coating’s porosity. It conditions the copper, allowing for a complete coverage in the TS28 bath.

TS-14 TDS

NS41 Nickel Stripper Solution

NS41 is a nickel stripper concentrate. This is used in combination with stabilized hydrogen peroxide, Cir130A, to strip nickel metal from copper substrates. NS41 gives very little copper attack. The NS41 process leaves the copper bright and shiny and ready for further processing. NS41 is used for electroless and electrolytically plated nickel. NS41 will not strip gold. Gold stripping must be done prior to nickel stripping, when necessary.

NS-41 TDS

ENIG IG300 Immersion Gold

The ENIG IG300 Immersion Gold solution is specially formulated to deposit immersion gold over electroless nickel on printed circuit boards. This is the last step of the ENIG process designed to produce a solderable finish. The gold deposit produced is 2 – 4 microinches (0.05 – 0.10 microns) thick.

IG-300 TDS

ENIG EN300 Electroless Nickel

The ENIG EN300 Electroless Nickel bath deposits a uniform layer of nickel metal with a medium phosphorous content. This electroless nickel bath is specially formulated to plate nickel only onto copper surfaces. Skip plating, background plating, and “black pad” are not a concern with this solution.

EN-300 TDS

CT-300 ENIG Catalyst

The ENIG CT300 Catalyst is a key step in the Electroless Nickel Immersion Gold process. It is a palladium activator that catalyzes the copper surface enabling electroless nickel deposition. Use of a pre- dip is required before the palladium activator step. The pre-dip protects and limits drag-in to the activator bath. Use of an acid post dip is also required after the activator.

CT-300 TDS

PC-5012 Pattern Cleaner

PC-5012 is a highly concentrated, acidic, liquid concentrate which is use to clean copper clad laminate prior to the pattern plating process. It contains a concentrated blend of acids and surfactants developed and designed to remove and dissolve surface films normally found during pattern plating. It contains no ammonia, chelators or solvents. PC-5012 does not contain alkyl phenol type surfactants.

PC-5012 TDS

IS-175 Silver Anti-Tarnish

IS175 is a highly effective anti-tarnish for immersion silver. This solution coats the silver with an invisible tarnish inhibiting layer. Anti-tarnish coated silver exhibits good solderability. This bath can be run as the last step of an immersion silver process. If the immersion silver coating is tarnished, then the tarnish should be removed before application of this antitarnish.

IS-175 TDS

IS-150 Immersion Silver

This is an Immersion Silver process that can be used as a direct replacement for the hot air solder leveling process. It covers all copper surfaces with a very dense metallic silver deposit that retains its solderability for over one year. This process will always produce a flat solderable surface that is desirable for surface mount components. The coating is uniform over the whole copper area.

IS-150 TDS

CirEtch 130 Micro-Etch

CirEtch 130 is an easy to use, stabilized, hydrogen peroxide/sulfuric acid, copper micro etch. It has been designed to be used in the printed circuit industry. It can be used to increase the surface bonding of copper to copper, preventing poor adhesion of copper and blisters and peelers. It’s varied etching characteristic makes it an excellent etchant for the pre-plate line as well as for the pattern plating line. CirEtch 130 is ideal for use with many final finishes, such as immersion silver, ENIG, and immersion tin. Cir130 produces the proper surface topography to enhance solderability.

CIR-130 TDS