HN-504 is the heart of the OS TECH Direct Plating System. It provides the constituents that render nonconductive surfaces conductive. HN-504 is packaged as a two-component system. HN-504A Carrier is the aqueous stabilizer solution and HN-504B Catalyst is the precious metal-containing suspension. When HN-504B is mixed with HN-504A they form the HN-504 activator bath.
HN-505 accelerator lowers the resistance of nonconductive surfaces rendered conducive by treating in HN-504 activator. HN-505A is a free flowing powder that is dissolved in water with a small amount of HN-505B Kick Start to form the HN-505 accelerator bath.
AC-178 is a post-catalyst solution designed to accelerate the electroless copper coverage on catalyzed material. It has been designed to help dissolve the hydroxide tin complex, which was produced in the rinse steps following activator CT-164. AC-178 will remove excess tin hydroxide from the copper surface thereby aiding in the adhesion of electroless copper to the copper foil.
AT-701 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide a temporary tarnish protection for copper. The AT-701 product has been formulated to remove light copper oxides and leave behind a chemically bonded anti-tarnish organic film. This clean protective surface will allow better bonding of dry film and other photo resists to the copper surface. The treated surface will prevent surface oxidation, tarnishing and staining. AT-701 does not contain any chromates or waxes, and can easily be removed with a mild surface etch.
EC-74 is a versatile electroless copper process that has been engineered for today’s sophisticated circuit boards. EC-74 is formulated to provide a substantial, fine grained structured copper film. EC-74 is formulated to provide a deposit having uniform physical properties ideal for high performance multilayer manufacturing and processing of all resists.
Excelplate EC-200 is specially formulated to plate 0.25 microns (10 millionths of an inch) of copper in 10 minutes. This bath is highly stable, easy to replenish and run, and does not plate out during periods of inactivity. It is especially suitable as a low deposit copper for printed circuit board that will be flash electroplated. EC-200 is also recommended for plating of ceramics, as the conductive copper film serves as an excellent base for further electroplating.
CT-164 is an important part of activation of printed circuit boards. It is a single step, low acid catalyst designed to be used in the electronic industry as an activator for non active surfaces that will promote electroless copper coverage. CT-164 contains a balanced blend of acidic chloride compounds which helps to prevent the attack of black oxide inner layers. It is the ideal activator for multi-layered activation.
PD-140C is an acidic crystal compound that is used to make up a working PD-140 solution. It is an important part of the activation of printed circuit boards. PD-140 is supplied either in a dry or liquid form. It is designed to be used prior to the CT-164 activator. It protects the activator solution from contamination and normality imbalance. PD-140 contains a special blend of acidic compounds that help it increase the coating’s deposit energy. It pre-conditions the epoxy fiberglass allowing for the proper absorption of the catalyst solution. PD-140C is supplied as dry salt crystals, which allow for easy make up of the working solution.
AC-177 is a non-fluoride post-catalyst solution designed to accelerate the electroless copper coverage on catalyzed material. It has been designed to dissolve the hydroxide tin complex produced in the rinse steps following activator CT-164. AC-177 will remove excess tin hydroxide from the copper surface thereby aiding in the adhesion of electroless copper to the copper foil. Used prior to the electroless copper, AC-177 will help prevent the accidental drag in of catalyst into the electroless copper bath, and help increase its stability.
