EB-610 is a water soluble, liquid solvent blend that is used to condition epoxy material. When used prior to permanganate etch back it helps to accelerate the action of the etch. It can also be used after sulfuric acid etch back to aide in the adhesion of electroless copper deposition. Its cleans the hole wall surfaces from debris allowing for maximum adhesion of the copper.
EB-610 Solvent Swell
Description
EB-610 is a water soluble, liquid solvent blend that is used to condition epoxy material. When used prior to permanganate etch back it helps to accelerate the action of the etch. It can also be used after sulfuric acid etch back to aide in the adhesion of electroless copper deposition. Its cleans the hole wall surfaces from debris allowing for maximum adhesion of the copper.
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