CirEtch 200 is a mildly acidic micro-etch used for cleaning copper surfaces of printed wiring boards. This micro-etch can be used in innerlayer bonding, pre-cleaning prior to hot air leveling and for pre-electroless and pre-plating applications. It has the advantages of producing a controlled micro-etch rate and requires no mixing. It is ready to use.
CirEtch 200 Copper Micro-Etch
Description
CirEtch 200 is a mildly acidic micro-etch used for cleaning copper surfaces of printed wiring boards. This micro-etch can be used in innerlayer bonding, pre-cleaning prior to hot air leveling and for pre-electroless and pre-plating applications. It has the advantages of producing a controlled micro-etch rate and requires no mixing. It is ready to use.
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