The TS Immersion Tin process is a lead-free replacement for the hot air leveling process. It covers the copper surface with a specialized-engineered immersion white tin metal that retains solderability through multiple assembly cycles.
TS14 is an important part of the TS immersion coating process. It is designed to be used as a pre-dip to the TS28 Immersion Tin solution. It protects the tin solution from contamination and normality imbalance. TS14 contains a special blend of acidic and organic compounds that control the coating’s porosity. It conditions the copper, allowing for a complete coverage in the TS28 bath.
TS-14 Immersion Tin Pre Dip
Description
The TS Immersion Tin process is a lead-free replacement for the hot air leveling process. It covers the copper surface with a specialized-engineered immersion white tin metal that retains solderability through multiple assembly cycles.
TS14 is an important part of the TS immersion coating process. It is designed to be used as a pre-dip to the TS28 Immersion Tin solution. It protects the tin solution from contamination and normality imbalance. TS14 contains a special blend of acidic and organic compounds that control the coating’s porosity. It conditions the copper, allowing for a complete coverage in the TS28 bath.
Related products
OS-611 Reflow Flux
OS-201 Solder Stripper
Processing Guide