OS-622 Reflow Oil
OS-622 TDS
OS-622 TDS
OS611 TDS
OS461 TDS
RF 450 IR Fusing Flux is an organic water-soluble fusing fluid that has been custom blended for tin-lead infrared fusing machines. It contains activators, which clean exposed copper, thereby providing excellent edge coverage.
WS250 Reflow Oil is a low viscosity completely water soluble fluid for oil fusing or leveling. WS250 Reflow Oil is stable at leveling and fusing temperatures thus minimizing carbonization. WS250 Reflow Oil is a stabilized oil and may require some initial break in. Alternatively, add some spent oil or some flux to hasten the break in period.
WS 222 REFLOW OIL is a low viscosity, non-foaming and completely water-soluble fluid for oil fusing or leveling. WS222 REFLOW OIL is stable at leveling and fusing temperatures thus minimizing carbonization. WS222 REFLOW OIL is a stabilized oil and may require some initial break-in. Alternatively, add some spent oil or some flux to hasten the break in period. WS222 works well with Hot Oil leveling machines and is effective as a dross blanket in horizontal hot air leveling machines.
WS 220 REFLOW OIL is a low viscosity, non-foaming and completely water-soluble fluid for oil fusing or leveling. WS220 REFLOW OIL is stable at leveling and fusing temperatures thus minimizing carbonization. WS220 REFLOW OIL is a stabilized oil and may require some initial break in or. Alternatively, add some spent oil or some flux to hasten the break in period. WS220 works well with Hot Oil leveling machines and is effective as a dross blanket in horizontal hot air leveling machines.
WS 210 REFLOW OIL is a low viscosity, non-foaming and completely water-soluble fluid for oil fusing or leveling. WS210 REFLOW OIL is stable at leveling and fusing temperatures thus minimizing carbonization. WS210 REFLOW OIL has no break in period. Just heat to temperature and use.
WS 215 REFLOW OIL is a low viscosity, non-foaming and completely water-soluble fluid for quenching after hot air leveling. WS215 REFLOW OIL is used to cool the solder after Hal prior to rinsing.
HO351 is a specially formulated chemical used for fusing and leveling solder-plated printed circuit boards by immersion reflow technique. HO351 FUSISNG FLUX serves as a tarnish remover and prevents oxidation during reflow. It also does not splatter and has significantly reduced flammability hazards compared to alcohol-based fluxes.