Products

OS-253 TDS

OS204 Solder Stripper is a single step, nonperoxide activated, nonchelated stripper designed to completely dissolve electroplated tin and tin/lead. It is effective on both fused and unfused deposits. OS204 is virtually free from exotherm as it dissolves solder. Because it gasses much less than peroxide type strippers, OS204 produces much sharper lines of demarcation between stripped and unstripped areas. This also reduces the chance of dark holes caused by attack of solder stripper fumes above the tape line when stripping solder from contact tips of printed circuit boards. OS204 leaves copper bright and does not attack the butter coat on printed circuit boards. Unlike peroxide activated solder strippers, used baths of OS204 do not “go flat” while standing idle. This makes OS204 ideal for intermittent stripping operations. OS204 contains no chelating agents, such as ammonium ions, so spent baths can be easily waste treated by simple pH adjustment.

OS-204 TDS

OS203 is a peroxide activated tin and tin/lead stripper for single step dip or spray processes. It is also used as the second step in two-step dip stripping processes. OS203 is inhibited to retard attack on copper and epoxy glass substrates. It also contains stabilizers to minimize peroxide decomposition during storage and after contamination with stripped metallic ions. OS203 provides fast stripping and uniformity of removal rate so it is ideal for automated tin/lead stripping and precious metal plating machines.

OS-203 TDS

SS-200 solder stripper is a stabilized hydrogen peroxide based solution formulated to strip solder and tin. The product offers extremely short strip times and long bath life in both spray and immersion applications. SS-200 has the ability to dissolve 20oz. /gal. of solder or more before being spent.

SS-200 TDS

EZ6001 Solder Stripper is a one part nitric-based solder stripper. It has been specifically designed to rapidly strip solder and solder/copper intermetallics in one step. EZ6001 has been designed in a unique way to minimize sludging and provide long life. Anti-tarnishing agents and inhibitors have also been added to minimize attack on copper and provide a bright finish on the copper with minimal oxidation.

EZ-6001 TDS

EZ-7001 is a single component concentrated replenisher for use with EZ-5050 or ACT-4040. Use of EZ-7001 enables increased loading and longer bath life. It is not designed to be used as a start-up chemistry.

EZ-7001 TDS

EZ5053 is a one part solder and tin stripper, based on nitric acid and ferric nitrate. EZ5053 is an enhanced version of EZ5050 solder stripper, and is specifically designed to strip in small holes. Anti-tarnishing agents and inhibitors have been added to minimize attach on copper and provide a bright finish.

EZ-5053 TDS

EZ5050 is a one part solder and tin stripper. It is based on nitric acid and ferric nitrate. EZ5050 has been specifically designed to rapidly strip solder and tin in one step. Anti-tarnishing agents and inhibitors have been added to minimize attack on copper and provide a bright finish.

EZ5050 TDS

ACT 4040 is specially formulated to strip tin-lead (solder) and tin deposits from copper circuits on printed circuit boards. The bath is highly stable and reliable, and contains no toxic fluorides, fluoborates, or peroxides. Operating at room temperature, ACT 4040 will rapidly dissolve these deposits, and will also dissolve molten solder deposits and cleans tabs for re-soldering. ACT 4040 is highly recommended for use in general electronic and printed circuit board fabrication operations. It can be used to ensure a clean, solder free surface for subsequent plating and other processing operations. ACT 4040 is one of a new generation of environmentally friendly products. All of the components are biodegradable, easily waste treated, and are as safe as current technology allows.

ACT4040 TDS

SS2 Copper Conditioner is used in batch solder stripping applications to remove the intermetallic layer and provide a clean tarnish resistant copper surface. It is also used as a copper cleaner and conditioner prior to hot air leveling or other molten solder applications. SS2 quickly removes surface tarnish with a controlled micro-etch and leaves the copper surface solderable for days without any mechanical or other chemical steps. In addition, SS2 is suitable for use prior to the solder mask applications.

SS2 TDS