EZ7000 is a one part solder and tin stripper. It is based on nitric acid and ferric nitrate. EZ7000 has been specifically designed to rapidly strip solder and tin in one step. Anti-tarnishing agents and inhibitors have been added to minimize attack on copper and provide a bright finish.
SC-3 SCREEN CLEANER is a specialty blend of esters used to clean screens. This material will remove solder masks, legend inks and primary image inks. This product is free of glycol ethers (“butyls”) and chlorinated solvents. SC3 is classified as non-hazardous. SC-3 SCREEN CLEANER is distillable and fuel blendable. This product has a high flash point, excellent solvency and a low vapor pressure. Further; it is biodegradable.
OS-108NO Screen Cleaner is a non glycol ether, non chlorinated, free rinsing, slow evaporating, mild odor cleaner formulated to remove uncured soldermask, uncured legend ink, and uncured primary image ink from screens and parts. OS-108NO is non corrosive to aluminum screen chases and is safe for use on stainless steel and polyester screen fabric.
OS243 Solder Stripper is a single step, nonperoxide, nonfluoride, nonchelated stripper designed to
quickly and completely remove electroplated tin and tin/lead from copper surfaces. It is also effective on
fused deposits. OS243 is virtually free from exotherm and does not attack exposed laminate on printed
circuit boards. OS243 contains no chelating agents, such as ammonium ions, so spent baths can be easily
waste treated by simple hydroxide precipitation methods.
HN-504 is the heart of the OS TECH Direct Plating System. It provides the constituents that render nonconductive surfaces conductive. HN-504 is packaged as a two-component system. HN-504A Carrier is the aqueous stabilizer solution and HN-504B Catalyst is the precious metal-containing suspension. When HN-504B is mixed with HN-504A they form the HN-504 activator bath.
HN-505 accelerator lowers the resistance of nonconductive surfaces rendered conducive by treating in HN-504 activator. HN-505A is a free flowing powder that is dissolved in water with a small amount of HN-505B Kick Start to form the HN-505 accelerator bath.
AC-178 is a post-catalyst solution designed to accelerate the electroless copper coverage on catalyzed material. It has been designed to help dissolve the hydroxide tin complex, which was produced in the rinse steps following activator CT-164. AC-178 will remove excess tin hydroxide from the copper surface thereby aiding in the adhesion of electroless copper to the copper foil.
WS 218 QUENCHING OIL is a low-foaming and completely water-soluble fluid for quenching after hot air leveling. WS218 QUENCHING OIL is used to cool the solder after HASL prior to rinsing.
OS-973* Dry Film Solder Mask Remover is an alkaline liquid designed to remove fully cured dry film solder mask and most photoimageable solder masks from printed circuit boards. OS-973* removes solder mask with much less exposure time than most competitive products. The solder mask is removed without damage to the circuitry or to the epoxy laminate.
TS28 is specially engineered “Immersion White Tin” processes that can be used as a direct replacement for the hot air solder leveling process. It will cover active copper surfaces with a very dense white tin that retains its solderability in excess of one year. The key to the process is the type and structure of the deposit. It is a fine crystalline structure that is non-porous.
The TS28 process consists of two proprietary products. The first is TS14, a pre dip solution that activates the copper surface. This ensures that the subsequent step, TS28, will chemically deposit the correct structure of white tin.
