EZ5053 is a one part solder and tin stripper, based on nitric acid and ferric nitrate. EZ5053 is an enhanced version of EZ5050 solder stripper, and is specifically designed to strip in small holes. Anti-tarnishing agents and inhibitors have been added to minimize attach on copper and provide a bright finish.
EZ5050 is a one part solder and tin stripper. It is based on nitric acid and ferric nitrate. EZ5050 has been specifically designed to rapidly strip solder and tin in one step. Anti-tarnishing agents and inhibitors have been added to minimize attack on copper and provide a bright finish.
ACT 4040 is specially formulated to strip tin-lead (solder) and tin deposits from copper circuits on printed circuit boards. The bath is highly stable and reliable, and contains no toxic fluorides, fluoborates, or peroxides. Operating at room temperature, ACT 4040 will rapidly dissolve these deposits, and will also dissolve molten solder deposits and cleans tabs for re-soldering. ACT 4040 is highly recommended for use in general electronic and printed circuit board fabrication operations. It can be used to ensure a clean, solder free surface for subsequent plating and other processing operations. ACT 4040 is one of a new generation of environmentally friendly products. All of the components are biodegradable, easily waste treated, and are as safe as current technology allows.
SS2 Copper Conditioner is used in batch solder stripping applications to remove the intermetallic layer and provide a clean tarnish resistant copper surface. It is also used as a copper cleaner and conditioner prior to hot air leveling or other molten solder applications. SS2 quickly removes surface tarnish with a controlled micro-etch and leaves the copper surface solderable for days without any mechanical or other chemical steps. In addition, SS2 is suitable for use prior to the solder mask applications.
SS-A/B Solder Stripper is specifically designed for solder and tin stripping applications. SS-A is to be used in conjunction with SS-B for the first part in a two stage solder stripper. The two parts of this stripper are separate to maximize stability and ensure a long shelf life. It contains no complex fluorides thus avoiding the possibility of solution exotherming, and will not attack laminate. SS-A/B strips rapidly and stops at the intermetallic layer between the solder and copper therefore allowing the board to remain in the stripping solution without being damaged. The intermetallic layer is removed quickly using SS2 copper conditioner or EZ 6001 Solder stripper.
