EZ7000 is a one part solder and tin stripper. It is based on nitric acid and ferric nitrate. EZ7000 has been specifically designed to rapidly strip solder and tin in one step. Anti-tarnishing agents and inhibitors have been added to minimize attack on copper and provide a bright finish.
OS243 Solder Stripper is a single step, nonperoxide, nonfluoride, nonchelated stripper designed to
quickly and completely remove electroplated tin and tin/lead from copper surfaces. It is also effective on
fused deposits. OS243 is virtually free from exotherm and does not attack exposed laminate on printed
circuit boards. OS243 contains no chelating agents, such as ammonium ions, so spent baths can be easily
waste treated by simple hydroxide precipitation methods.
OS-201 SOLDER STRIPPER is the first step in the two-step solder stripping process to prepare solder mask over bare copper (SMOBC) printed circuit boards. OS-201 contains no peroxide, no fluorides, and no chelating agents to complicate waste treatment. Little or no heat is generated by OS-201, so exposed laminate and copper circuitry is not at risk of damage from strong exothermic reactions typical of peroxide-based solder strippers. OS-201 dissolves both tin and lead resulting in less sludging in the bath than most one-step solder strippers. OS-201 provides long bath life and low-use cost.
OS-251 Solder Stripper and Copper Brightener is the renewable second step in the two-step, non-peroxide, solder stripping process. The two-step process eliminates problems typically associated with peroxide-based solder strippers such as exotherm, attack on exposed laminate, generation of acid fumes and mists, and difficult waste treatment. OS-251 is non-chelated and free from fluorides so it can be readily waste treated by simple hydroxide precipitation methods.
OS204 Solder Stripper is a single step, nonperoxide activated, nonchelated stripper designed to completely dissolve electroplated tin and tin/lead. It is effective on both fused and unfused deposits. OS204 is virtually free from exotherm as it dissolves solder. Because it gasses much less than peroxide type strippers, OS204 produces much sharper lines of demarcation between stripped and unstripped areas. This also reduces the chance of dark holes caused by attack of solder stripper fumes above the tape line when stripping solder from contact tips of printed circuit boards. OS204 leaves copper bright and does not attack the butter coat on printed circuit boards. Unlike peroxide activated solder strippers, used baths of OS204 do not “go flat” while standing idle. This makes OS204 ideal for intermittent stripping operations. OS204 contains no chelating agents, such as ammonium ions, so spent baths can be easily waste treated by simple pH adjustment.
OS203 is a peroxide activated tin and tin/lead stripper for single step dip or spray processes. It is also used as the second step in two-step dip stripping processes. OS203 is inhibited to retard attack on copper and epoxy glass substrates. It also contains stabilizers to minimize peroxide decomposition during storage and after contamination with stripped metallic ions. OS203 provides fast stripping and uniformity of removal rate so it is ideal for automated tin/lead stripping and precious metal plating machines.
SS-200 solder stripper is a stabilized hydrogen peroxide based solution formulated to strip solder and tin. The product offers extremely short strip times and long bath life in both spray and immersion applications. SS-200 has the ability to dissolve 20oz. /gal. of solder or more before being spent.
EZ6001 Solder Stripper is a one part nitric-based solder stripper. It has been specifically designed to rapidly strip solder and solder/copper intermetallics in one step. EZ6001 has been designed in a unique way to minimize sludging and provide long life. Anti-tarnishing agents and inhibitors have also been added to minimize attack on copper and provide a bright finish on the copper with minimal oxidation.