Reflow Tin/Solder

WS 215 REFLOW OIL is a low viscosity, non-foaming and completely water-soluble fluid for quenching after hot air leveling. WS215 REFLOW OIL is used to cool the solder after Hal prior to rinsing.

WS215 TDS

HO351 is a specially formulated chemical used for fusing and leveling solder-plated printed circuit boards by immersion reflow technique. HO351 FUSISNG FLUX serves as a tarnish remover and prevents oxidation during reflow. It also does not splatter and has significantly reduced flammability hazards compared to alcohol-based fluxes.

HO351 TDS

SB100 Solder Brightener is designed to clean, neutralize and brighten tin and tin-lead alloys after etching copper with alkaline solutions.

SB100 TDS