SB100 Solder Brightener
SB100 Solder Brightener is designed to clean, neutralize and brighten tin and tin-lead alloys after etching copper with alkaline solutions.
PCB Fabrication Chemicals
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Rinse Aid 2000
Rinse Aid 2000 is a biodegradable, alkaline, organic concentrate used to assist in the removal of residues following soldering and fusing processes using fluxes. Rinse Aid 2000 works without the use of silicone defoamers.
WS220 Reflow Oil
WS 220 REFLOW OIL is a low viscosity, non-foaming and completely water-soluble fluid for oil fusing or leveling. WS220 REFLOW OIL is stable at leveling and fusing temperatures thus minimizing carbonization. WS220 REFLOW OIL is a stabilized oil and may require some initial break in or, alternatively, add some spent oil or some flux to hasten the break in period. WS220 works well with Hot Oil leveling machines and is effective as a dross blanket in horizontal hot air leveling machines.
HA1044 Hot Air Flux
HA1044 is a very low viscosity water-soluble flux formulated expressly for horizontal hot air leveling system. The viscosity is controlled to minimize de-wetting on surface mount pads and is formulated to insure first pass coverage on even difficult boards. This flux is also formulated to minimize SIR degradation associated with hot air leveling.
HA-405 Hot Air Flux
HA405 is a specially formulated, high-viscosity flux for hot air leveling. The viscosity is controlled to minimize de-wetting on surface mount pads and is formulated to insure first pass coverage on difficult boards.
HA-305 Hot Air Flux
HA305 is a medium viscosity, water-soluble flux formulated expressly for vertical hot air leveling systems, both manual and automatic. The viscosity is controlled to minimize de-wetting on surface mount pads and is formulated to insure first pass coverage on difficult boards.
HA-205 Hot Air Flux
HA205 is a specially formulated, low-viscosity flux for hot air leveling. The viscosity is controlled to minimize de-wetting on surface mount pads and is formulated to insure first pass coverage on difficult boards.
HARAJ65X Hot Air Flux
HARAJ65X is a medium to high viscosity water-soluble flux formulated expressly for vertical hot air leveling systems, both manual and automatic. The viscosity is controlled to minimize de-wetting on surface mount pads and is formulated to insure first pass coverage on even difficult boards. HARAJ65X provides complete solder coverage on solder mask defined pads. There are also additives to this flux to minimize bridging on fine pitch surface mount pads. This flux is also especially suited for flat finishes on surface mount pads.
SS3 Copper Cleaner
SS3 Copper Conditioner is used in a horizontal or vertical pre-cleaning line providing a clean tarnish resistant copper surface. SS3 quickly removes surface tarnish with a controlled micro-etch and leaves the copper surface solderable for days without any mechanical or other chemical steps. In addition, SS3 is suitable for use prior to the solder mask applications to prevent tarnish from appearing on the copper surface.
CirEtch 200 Copper Micro-Etch
CirEtch 200 is a mildly acidic micro-etch used for cleaning copper surfaces of printed wiring boards. This micro-etch can be used in innerlayer bonding, pre-cleaning prior to hot air leveling and for pre-electroless and pre-plating applications. It has the advantages of producing a controlled micro-etch rate and requires no mixing. It is ready to use.