SS3 Copper Conditioner is used in a horizontal or vertical pre-cleaning line providing a clean tarnish resistant copper surface. SS3 quickly removes surface tarnish with a controlled micro-etch and leaves the copper surface solderable for days without any mechanical or other chemical steps. In addition, SS3 is suitable for use prior to the solder mask applications to prevent tarnish from appearing on the copper surface.
CirEtch 200 is a mildly acidic micro-etch used for cleaning copper surfaces of printed wiring boards. This micro-etch can be used in innerlayer bonding, pre-cleaning prior to hot air leveling and for pre-electroless and pre-plating applications. It has the advantages of producing a controlled micro-etch rate and requires no mixing. It is ready to use.
CirEtch 130 is an easy to use, stabilized, hydrogen peroxide/sulfuric acid, copper micro etch. It has been designed to be used in the printed circuit industry. It can be used to increase the surface bonding of copper to copper, preventing poor adhesion of copper and blisters and peelers. It’s varied etching characteristic makes it an excellent etchant for the pre-plate line as well as for the pattern plating line. CirEtch 130 is ideal for use with many final finishes, such as immersion silver, ENIG, and immersion tin. Cir130 produces the proper surface topography to enhance solderability.
CirEtch 100 is a mildly acidic micro-etch used for cleaning copper surfaces of printed wiring boards. This micro-etch can be used in innerlayer bonding, pre-cleaning prior to hot air leveling and for pre-electroless and pre-plating applications. The advantages of this micro-etch versus other mild etch solutions includes a more consistent etch rate, stability and extended solution life. A working solution of CirEtch 100 should hold a water break, have a uniform matte pink appearance and hold up to 3 oz/gal of copper.