GE-77 is an acidic, dry crystalline powder which is use to frost and etch glass fibers found exposed after the multilayer etch back cycle. It contains a concentrated blend of fluorides developed and designed to ensure removal of debris and promote good adhesion of electroless copper or other conductive coatings. GE-77 is used after the panels have been etched back and prior to the PTH line. It can also be used to remove drilling debris sometimes left embedded on the slots and holes of printed circuit boards.
EB-613 is an epoxy etch compound that is used to clear multilayer printed circuit broads of drilling residue prior to electroless copper coverage. It will promote good adhesion of electroless copper and direct metallization coating to the epoxy. It is part of a three part cleaning cycle; EB-610, EB-613 and EB-660. If properly used, it can produce etch back depths of 0.2 to 0.4 mil.
EB-610 is a water soluble, liquid solvent blend that is used to condition epoxy material. When used prior to permanganate etch back it helps to accelerate the action of the etch. It can also be used after sulfuric acid etch back to aide in the adhesion of electroless copper deposition. Its cleans the hole wall surfaces from debris allowing for maximum adhesion of the copper.