OS-108NO Screen Cleaner is a non glycol ether, non chlorinated, free rinsing, slow evaporating, mild odor cleaner formulated to remove uncured soldermask, uncured legend ink, and uncured primary image ink from screens and parts. OS-108NO is non corrosive to aluminum screen chases and is safe for use on stainless steel and polyester screen fabric.
OS-108 Screen Cleaner is a non glycol ether, non chlorinated, free rinsing, slow evaporating, mild odor cleaner formulated to remove uncured soldermask, uncured legend ink, and uncured primary image ink from screens and parts. OS-108 is non corrosive to aluminum screen chases and is safe for use on stainless steel and polyester screen fabric.
OS-105 Screen Cleaner is a non chlorinated water soluble, slow evaporating, mild odor cleaner formulated to remove uncured solder mask, uncured legend ink and uncured primary image ink from screens and parts. OS-105 is non corrosive to aluminum screen chases and is safe for use on stainless steel and polyester screen fabric.
OS-452 Spray Equipment Cleaner is a concentrated solution designed to clean and condition spray developing, etching, and stripping equipment. OS-452 effectively removes machine foulants such as dry film photoresist, etchant residues, and water hardness scale thereby restoring equipment to maximum efficiency. OS-452 is a chelated product. If a non-chelated product is required, use OS-494 Non-Chelated Equipment Cleaner.
For pre-cleaning prior to hot air leveling. Excellent removal of fingerprints, shop soils, and oxides. Provides ideal surface for molten solder adhesion. Non-chelated. Easy to waste treat.
OS-331 TDS
Acidic cleaner for inner layer pre-cleaning. Non-etching. Good cleaning for fingerprints and shop soils. Free rinsing. Contains no chlorides. Will not release chlorine gas if mixed with microetch solutions.
OS-304 Acid Cleaner is an extremely free rinsing cleaner for removal of chromates, fingerprints, shop soils, and oxides from copper and copper alloys. OS-304 is non etching, removing oxides with little or no attack on basis metal. It contains no chelating agents or other ingredients that complicate waste treatment. Dry films and primary image screening resists are not attacked by OS-304 solutions.