NI-10 Additive
Nickel 10 Additive is intended as an additive to increase the nickel content of SN100CL lead-free solder. SN100CLe should be used for regular additions to maintain the level of the solder pot.
Solder can be made into many different physical forms including wire, bar, and powder. Solder bar is simply solder in bar form. Florida CirTech uses a casting process in a nitrogen atmosphere to produce bar solder with a very low oxide content.
Nickel 10 Additive is intended as an additive to increase the nickel content of SN100CL lead-free solder. SN100CLe should be used for regular additions to maintain the level of the solder pot.
AO1000 is a germanium (Ge) concentrate. When added to SN100CL HASL solder, AO1000 eliminates tarnish and will maintain a bright, shiny solder surface.
Florida CirTech’s Nitro-Flo Plus bar solder is cast under an inert atmosphere, which produces an ultra-low oxide bar. Florida CirTech pioneered an automated system that casts every bar without the use of manual labor to eliminate contaminates. This proprietary manufacturing process yields a bar that will produce the lowest dross levels during soldering operations.
The transition to lead free solder has forced many companies to evaluate their PCB final finish. One of the more popular finishes is Hot Air Surface Leveling otherwise known as HASL. Florida CirTech, in collaboration with Nihon Superior, has established a viable lead free HASL process utilizing the SN100CL lead free alloy. SN100CL Lead-Free HASL process offers superior solderability to other competitive final finishes.