CC-108 contains a concentrated blend of surfactants and wetting agents that has designed to clean the copper foil surface prior to the electroless copper deposition. CC-108 has been formulated to remove fingerprints and light oils from copper foil. It contains conditioning agents which activate glass fibers and epoxy, allowing for a reliable absorption of the catalyst. CC-108 has been designed so it can be easily removed from the copper surface with cold tap water.
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