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PCB Fabrication Chemicals

EZ7000 is a one part solder and tin stripper. It is based on nitric acid and ferric nitrate. EZ7000 has been specifically designed to rapidly strip solder and tin in one step. Anti-tarnishing agents and inhibitors have been added to minimize attack on copper and provide a bright finish.

EZ7000 TDS

OS-105 Screen Cleaner is a non chlorinated water soluble, slow evaporating, mild odor cleaner formulated to remove uncured solder mask, uncured legend ink and uncured primary image ink from screens and parts. OS-105 is non corrosive to aluminum screen chases and is safe for use on stainless steel and polyester screen fabric.

OS-105 TDS

PC-5009 is an acidic, liquid concentrate. It is used to clean copper clad laminate prior to the pattern plating process. It contains a concentrated blend of acids and surfactants developed and designed to remove and dissolve surface films normally found during pattern plating. It contains no ammonia, chelators or solvents.

PC-5009 TDS

PC-5012 is a highly concentrated, acidic, liquid concentrate. It is used to clean copper clad laminate prior to the pattern plating process. It contains a concentrated blend of acids and surfactants developed and designed to remove and dissolve surface films normally found during pattern plating. It contains no ammonia, chelators or solvents. PC-5012 does not contain alkyl-phenol type surfactants.

PC-5012 TDS

SC-4 Screen Cleaner is a specialty blend of esters used to clean screens. SC-4 has the added benefit of the powerful solvent in orange oil. This material will remove solder masks, legend inks and primary image inks. This product is free of glycol ethers (“butyls”) and chlorinated solvents. This product is classified as non-hazardous. SC-4 Screen Cleaner is distillable and fuel blend able. This product has a high flash point, excellent solvency and a low vapor pressure. Further; it is biodegradable.

SC-4 TDS

SC-5 Screen Cleaner is a specialty blend of esters used to clean screens. This material will remove solder masks, legend inks and primary image inks. This product is free of chlorinated solvents and is classified as non-hazardous. SC-5 Screen Cleaner is distillable and fuel blend able. This product has a high flash point, excellent solvency, low vapor pressure and is biodegradable.

SC-5 TDS

Non-etching soak cleaner for use prior to pattern plating. Free rinsing. Low use cost. Excellent cleaning of fingerprints and shop soils. Non-chelated. Easy to waste treat. (Must follow with microetch to remove adhesion promoter)

OS-303 TDS

OS-304 Acid Cleaner is an extremely free rinsing cleaner for removal of chromates, fingerprints, shop soils, and oxides from copper and copper alloys. OS-304 is non etching, removing oxides with little or no attack on basis metal. It contains no chelating agents or other ingredients that complicate waste treatment. Dry films and primary image screening resists are not attacked by OS-304 solutions.

OS-304 TDS

Acidic cleaner for inner layer pre-cleaning. Non-etching. Good cleaning for fingerprints and shop soils. Free rinsing. Contains no chlorides. Will not release chlorine gas if mixed with microetch solutions.

OS-317 TDS

OS-452 Spray Equipment Cleaner is a concentrated solution designed to clean and condition spray developing, etching, and stripping equipment. OS-452 effectively removes machine foulants such as dry film photoresist, etchant residues, and water hardness scale thereby restoring equipment to maximum efficiency. OS-452 is a chelated product. If a non-chelated product is required, use OS-494 Non-Chelated Equipment Cleaner.

OS-452 TDS

OS-108 Screen Cleaner is a non glycol ether, non chlorinated, free rinsing, slow evaporating, mild odor cleaner formulated to remove uncured soldermask, uncured legend ink, and uncured primary image ink from screens and parts. OS-108 is non corrosive to aluminum screen chases and is safe for use on stainless steel and polyester screen fabric.

OS-108 TDS

LD-4D2 LPI solder mask is a two component Liquid Photoimageable (LPI) solder mask that is highly reflective for use in LED devices.

LD-4D2 TDS

CC-108 contains a concentrated blend of surfactants and wetting agents that has designed to clean the copper foil surface prior to the electroless copper deposition. CC-108 has been formulated to remove fingerprints and light oils from copper foil. It contains conditioning agents which activate glass fibers and epoxy, allowing for a reliable absorption of the catalyst. CC-108 has been designed so it can be easily removed from the copper surface with cold tap water.

CC-108 TDS

CC-110 contains a concentrated blend of surfactants and wetting agents that has designed to clean the copper foil surface prior to the electroless copper deposition. CC-110 has been formulated to remove fingerprints and light oils from copper foil. It contains conditioning agents that activate glass fibers and epoxy, allowing for a reliable absorption of the catalyst. CC-110 has been designed so it can be easily rinsed from the copper surface with cold tap water.

CC-110 TDS

PD-140C is an acidic crystal compound that is used to make up a working PD-140 solution. It is an important part of the activation of printed circuit boards. PD-140 is supplied either in a dry or liquid form. It is designed to be used prior to the CT-164 activator. It protects the activator solution from contamination and normality imbalance. PD-140 contains a special blend of acidic compounds that help it increase the coating’s deposit energy. It pre-conditions the epoxy fiberglass allowing for the proper absorption of the catalyst solution. PD-140C is supplied as dry salt crystals, which allow for easy make up of the working solution.

PD-140C TDS

CT-164 is an important part of activation of printed circuit boards. It is a single step, low acid catalyst designed to be used in the electronic industry as an activator for non active surfaces that will promote electroless copper coverage. CT-164 contains a balanced blend of acidic chloride compounds which helps to prevent the attack of black oxide inner layers. It is the ideal activator for multi-layered activation.

CT-164 TDS

Excelplate EC-200 is specially formulated to plate 0.25 microns (10 millionths of an inch) of copper in 10 minutes. This bath is highly stable, easy to replenish and run, and does not plate out during periods of inactivity. It is especially suitable as a low deposit copper for printed circuit board that will be flash electroplated. EC-200 is also recommended for plating of ceramics, as the conductive copper film serves as an excellent base for further electroplating.

EC-200 TDS

EC-74 is a versatile electroless copper process that has been engineered for today’s sophisticated circuit boards. EC-74 is formulated to provide a substantial, fine grained structured copper film. EC-74 is formulated to provide a deposit having uniform physical properties ideal for high performance multilayer manufacturing and processing of all resists.

EC-74A TDS

AT-701 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide a temporary tarnish protection for copper. The AT-701 product has been formulated to remove light copper oxides and leave behind a chemically bonded anti-tarnish organic film. This clean protective surface will allow better bonding of dry film and other photo resists to the copper surface. The treated surface will prevent surface oxidation, tarnishing and staining. AT-701 does not contain any chromates or waxes, and can easily be removed with a mild surface etch.

AT-701 TDS

SS-A/B Solder Stripper is specifically designed for solder and tin stripping applications. SS-A is to be used in conjunction with SS-B for the first part in a two stage solder stripper. The two parts of this stripper are separate to maximize stability and ensure a long shelf life. It contains no complex fluorides thus avoiding the possibility of solution exotherming, and will not attack laminate. SS-A/B strips rapidly and stops at the intermetallic layer between the solder and copper therefore allowing the board to remain in the stripping solution without being damaged. The intermetallic layer is removed quickly using SS2 copper conditioner or EZ 6001 Solder stripper.

SS1AB TDS

PCB Fabrication Chemicals
EZ7000 is a one part solder and tin stripper. It is based on nitric acid and ferric nitrate. EZ7000 has been specifically designed to rapidly strip so Read More
OS-105 Screen Cleaner is a non chlorinated water soluble, slow evaporating, mild odor cleaner formulated to remove uncured solder mask, uncured legend Read More
PC-5009 is an acidic, liquid concentrate. It is used to clean copper clad laminate prior to the pattern plating process. It contains a concentrated bl Read More
PC-5012 is a highly concentrated, acidic, liquid concentrate. It is used to clean copper clad laminate prior to the pattern plating process. It contai Read More
SC-4 Screen Cleaner is a specialty blend of esters used to clean screens. SC-4 has the added benefit of the powerful solvent in orange oil. This mater Read More
SC-5 Screen Cleaner is a specialty blend of esters used to clean screens. This material will remove solder masks, legend inks and primary image inks. Read More
Non-etching soak cleaner for use prior to pattern plating. Free rinsing. Low use cost. Excellent cleaning of fingerprints and shop soils. Non-chelated Read More
OS-304 Acid Cleaner is an extremely free rinsing cleaner for removal of chromates, fingerprints, shop soils, and oxides from copper and copper alloys. Read More
Acidic cleaner for inner layer pre-cleaning. Non-etching. Good cleaning for fingerprints and shop soils. Free rinsing. Contains no chlorides. Will not Read More
OS-452 Spray Equipment Cleaner is a concentrated solution designed to clean and condition spray developing, etching, and stripping equipment. OS-452 e Read More
OS-108 Screen Cleaner is a non glycol ether, non chlorinated, free rinsing, slow evaporating, mild odor cleaner formulated to remove uncured soldermas Read More
LD-4D2 LPI solder mask is a two component Liquid Photoimageable (LPI) solder mask that is highly reflective for use in LED devices. LD-4D2 TDS
CC-108 contains a concentrated blend of surfactants and wetting agents that has designed to clean the copper foil surface prior to the electroless cop Read More
CC-110 contains a concentrated blend of surfactants and wetting agents that has designed to clean the copper foil surface prior to the electroless cop Read More
PD-140C is an acidic crystal compound that is used to make up a working PD-140 solution. It is an important part of the activation of printed circuit Read More
CT-164 is an important part of activation of printed circuit boards. It is a single step, low acid catalyst designed to be used in the electronic indu Read More
Excelplate EC-200 is specially formulated to plate 0.25 microns (10 millionths of an inch) of copper in 10 minutes. This bath is highly stable, easy t Read More
EC-74 is a versatile electroless copper process that has been engineered for today’s sophisticated circuit boards. EC-74 is formulated to provide a Read More
AT-701 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide a temporary tarnish pro Read More
SS-A/B Solder Stripper is specifically designed for solder and tin stripping applications. SS-A is to be used in conjunction with SS-B for the first p Read More
90 products « Page 1 of 5 »

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