The transition to lead free solder has forced many companies to evaluate their PCB final finish. One of the more popular finishes is Hot Air Surface Leveling otherwise known as HASL. Florida CirTech, in collaboration with Nihon Superior, has established a viable lead free HASL process utilizing the SN100CL lead free alloy. SN100CL Lead-Free HASL process offers superior solderability to other competitive final finishes.
Florida CirTech’s Nitro-Flo Plus bar solder is cast under an inert atmosphere, which produces an ultra-low oxide bar. Florida CirTech pioneered an automated system that casts every bar without the use of manual labor to eliminate contaminates. This proprietary manufacturing process yields a bar that will produce the lowest dross levels during soldering operations.