TS28 is specially engineered “Immersion White Tin” processes that can be used as a direct replacement for the hot air solder leveling process. It will cover active copper surfaces with a very dense white tin that retains its solderability in excess of one year. The key to the process is the type and structure of the deposit. It is a fine crystalline structure that is non-porous.
The TS28 process consists of two proprietary products. The first is TS14, a pre dip solution that activates the copper surface. This ensures that the subsequent step, TS28, will chemically deposit the correct structure of white tin.
TS-28 Immersion White Tin
Description
TS28 is specially engineered “Immersion White Tin” processes that can be used as a direct replacement for the hot air solder leveling process. It will cover active copper surfaces with a very dense white tin that retains its solderability in excess of one year. The key to the process is the type and structure of the deposit. It is a fine crystalline structure that is non-porous.
The TS28 process consists of two proprietary products. The first is TS14, a pre dip solution that activates the copper surface. This ensures that the subsequent step, TS28, will chemically deposit the correct structure of white tin.
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