This is an Immersion Silver process that can be used as a direct replacement for the hot air solder leveling process. It covers all copper surfaces with a very dense metallic silver deposit that retains its solderability for over one year. This process will always produce a flat solderable surface that is desirable for surface mount components. The coating is uniform over the whole copper area.
IS-150 Immersion Silver
Description
This is an Immersion Silver process that can be used as a direct replacement for the hot air solder leveling process. It covers all copper surfaces with a very dense metallic silver deposit that retains its solderability for over one year. This process will always produce a flat solderable surface that is desirable for surface mount components. The coating is uniform over the whole copper area.
Related products
SN-10 Electroless Tin
HA-1025 Hot Air Flux
OS-622 Reflow Oil
OS-243 Solder Stripper