This is an Immersion Silver process that can be used as a direct replacement for the hot air solder leveling process. It covers all copper surfaces with a very dense metallic silver deposit that retains its solderability for over one year. This process will always produce a flat solderable surface that is desirable for surface mount components. The coating is uniform over the whole copper area.
IS-150 Immersion Silver
Description
This is an Immersion Silver process that can be used as a direct replacement for the hot air solder leveling process. It covers all copper surfaces with a very dense metallic silver deposit that retains its solderability for over one year. This process will always produce a flat solderable surface that is desirable for surface mount components. The coating is uniform over the whole copper area.
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