The ENIG IG300 Immersion Gold solution is specially formulated to deposit immersion gold over electroless nickel on printed circuit boards. This is the last step of the ENIG process designed to produce a solderable finish. The gold deposit produced is 2 – 4 microinches (0.05 – 0.10 microns) thick.
ENIG IG300 Immersion Gold
Description
The ENIG IG300 Immersion Gold solution is specially formulated to deposit immersion gold over electroless nickel on printed circuit boards. This is the last step of the ENIG process designed to produce a solderable finish. The gold deposit produced is 2 – 4 microinches (0.05 – 0.10 microns) thick.
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