The ENIG EN300 Electroless Nickel bath deposits a uniform layer of nickel metal with a medium phosphorous content. This electroless nickel bath is specially formulated to plate nickel only onto copper surfaces. Skip plating, background plating, and “black pad” are not a concern with this solution.
ENIG EN300 Electroless Nickel
Description
The ENIG EN300 Electroless Nickel bath deposits a uniform layer of nickel metal with a medium phosphorous content. This electroless nickel bath is specially formulated to plate nickel only onto copper surfaces. Skip plating, background plating, and “black pad” are not a concern with this solution.
Related products
OS-611 Reflow Flux
WS250 Re-Flow Oil
RF-450 IR Fusing Flux