The ENIG EN300 Electroless Nickel bath deposits a uniform layer of nickel metal with a medium phosphorous content. This electroless nickel bath is specially formulated to plate nickel only onto copper surfaces. Skip plating, background plating, and “black pad” are not a concern with this solution.
ENIG EN300 Electroless Nickel
Description
The ENIG EN300 Electroless Nickel bath deposits a uniform layer of nickel metal with a medium phosphorous content. This electroless nickel bath is specially formulated to plate nickel only onto copper surfaces. Skip plating, background plating, and “black pad” are not a concern with this solution.
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Processing Guide