Excelplate EC-200 is specially formulated to plate 0.25 microns (10 millionths of an inch) of copper in 10 minutes. This bath is highly stable, easy to replenish and run, and does not plate out during periods of inactivity. It is especially suitable as a low deposit copper for printed circuit board that will be flash electroplated. EC-200 is also recommended for plating of ceramics, as the conductive copper film serves as an excellent base for further electroplating.
EC-200 Electroless Copper
Description
Excelplate EC-200 is specially formulated to plate 0.25 microns (10 millionths of an inch) of copper in 10 minutes. This bath is highly stable, easy to replenish and run, and does not plate out during periods of inactivity. It is especially suitable as a low deposit copper for printed circuit board that will be flash electroplated. EC-200 is also recommended for plating of ceramics, as the conductive copper film serves as an excellent base for further electroplating.
Related products
RF-450 IR Fusing Flux
OS-993 Soldermask Remover
OS-622 Reflow Oil