EB-613 is an epoxy etch compound that is used to clear multilayer printed circuit broads of drilling residue prior to electroless copper coverage. It will promote good adhesion of electroless copper and direct metallization coating to the epoxy. It is part of a three part cleaning cycle; EB-610, EB-613 and EB-660. If properly used, it can produce etch back depths of 0.2 to 0.4 mil.
EB-613 Multilayer Desmear
Description
EB-613 is an epoxy etch compound that is used to clear multilayer printed circuit broads of drilling residue prior to electroless copper coverage. It will promote good adhesion of electroless copper and direct metallization coating to the epoxy. It is part of a three part cleaning cycle; EB-610, EB-613 and EB-660. If properly used, it can produce etch back depths of 0.2 to 0.4 mil.
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