The ENIG CT300 Catalyst is a key step in the Electroless Nickel Immersion Gold process. It is a palladium activator that catalyzes the copper surface enabling electroless nickel deposition. Use of a pre- dip is required before the palladium activator step. The pre-dip protects and limits drag-in to the activator bath. Use of an acid post dip is also required after the activator.
CT-300 ENIG Catalyst
Description
The ENIG CT300 Catalyst is a key step in the Electroless Nickel Immersion Gold process. It is a palladium activator that catalyzes the copper surface enabling electroless nickel deposition. Use of a pre- dip is required before the palladium activator step. The pre-dip protects and limits drag-in to the activator bath. Use of an acid post dip is also required after the activator.
Related products
HARAJ65BR Hot Air Flux
Processing Guide
SN-10 Electroless Tin
OS-201 Solder Stripper