The ENIG CT300 Catalyst is a key step in the Electroless Nickel Immersion Gold process. It is a palladium activator that catalyzes the copper surface enabling electroless nickel deposition. Use of a pre- dip is required before the palladium activator step. The pre-dip protects and limits drag-in to the activator bath. Use of an acid post dip is also required after the activator.
CT-300 ENIG Catalyst
Description
The ENIG CT300 Catalyst is a key step in the Electroless Nickel Immersion Gold process. It is a palladium activator that catalyzes the copper surface enabling electroless nickel deposition. Use of a pre- dip is required before the palladium activator step. The pre-dip protects and limits drag-in to the activator bath. Use of an acid post dip is also required after the activator.
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