CirEtch 130 is an easy to use, stabilized, hydrogen peroxide/sulfuric acid, copper micro etch. It has been designed to be used in the printed circuit industry. It can be used to increase the surface bonding of copper to copper, preventing poor adhesion of copper and blisters and peelers. It’s varied etching characteristic makes it an excellent etchant for the pre-plate line as well as for the pattern plating line. CirEtch 130 is ideal for use with many final finishes, such as immersion silver, ENIG, and immersion tin. Cir130 produces the proper surface topography to enhance solderability.
CirEtch130 Micro-Etch
Description
CirEtch 130 is an easy to use, stabilized, hydrogen peroxide/sulfuric acid, copper micro etch. It has been designed to be used in the printed circuit industry. It can be used to increase the surface bonding of copper to copper, preventing poor adhesion of copper and blisters and peelers. It’s varied etching characteristic makes it an excellent etchant for the pre-plate line as well as for the pattern plating line. CirEtch 130 is ideal for use with many final finishes, such as immersion silver, ENIG, and immersion tin. Cir130 produces the proper surface topography to enhance solderability.
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