AT-701 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide a temporary tarnish protection for copper. The AT-701 product has been formulated to remove light copper oxides and leave behind a chemically bonded anti-tarnish organic film. This clean protective surface will allow better bonding of dry film and other photo resists to the copper surface. The treated surface will prevent surface oxidation, tarnishing and staining. AT-701 does not contain any chromates or waxes, and can easily be removed with a mild surface etch.
AT-701 Copper Anti-Tarnish
Description
AT-701 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide a temporary tarnish protection for copper. The AT-701 product has been formulated to remove light copper oxides and leave behind a chemically bonded anti-tarnish organic film. This clean protective surface will allow better bonding of dry film and other photo resists to the copper surface. The treated surface will prevent surface oxidation, tarnishing and staining. AT-701 does not contain any chromates or waxes, and can easily be removed with a mild surface etch.
Related products
OS-973 Dry Film Solder Mask Remover
Processing Guide
RF-450 IR Fusing Flux