ACT 4040 is specially formulated to strip tin-lead (solder) and tin deposits from copper circuits on printed circuit boards. The bath is highly stable and reliable, and contains no toxic fluorides, fluoborates, or peroxides. Operating at room temperature, ACT 4040 will rapidly dissolve these deposits, and will also dissolve molten solder deposits and cleans tabs for re-soldering. ACT 4040 is highly recommended for use in general electronic and printed circuit board fabrication operations. It can be used to ensure a clean, solder free surface for subsequent plating and other processing operations. ACT 4040 is one of a new generation of environmentally friendly products. All of the components are biodegradable, easily waste treated, and are as safe as current technology allows.