SS2 Copper Conditioner is used in batch solder stripping applications to remove the intermetallic layer and provide a clean tarnish resistant copper surface. It is also used as a copper cleaner and conditioner prior to hot air leveling or other molten solder applications. SS2 quickly removes surface tarnish with a controlled micro-etch and leaves the copper surface solderable for days without any mechanical or other chemical steps. In addition, SS2 is suitable for use prior to the solder mask applications.
SS2 Copper Conditioner
Description
SS2 Copper Conditioner is used in batch solder stripping applications to remove the intermetallic layer and provide a clean tarnish resistant copper surface. It is also used as a copper cleaner and conditioner prior to hot air leveling or other molten solder applications. SS2 quickly removes surface tarnish with a controlled micro-etch and leaves the copper surface solderable for days without any mechanical or other chemical steps. In addition, SS2 is suitable for use prior to the solder mask applications.
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