Product Line

EC-74 Electroless Copper

EC-74 is a versatile electroless copper process that has been engineered for today’s sophisticated circuit boards. EC-74 is formulated to provide a substantial, fine grained structured copper film. EC-74 is formulated to provide a deposit having uniform physical properties ideal for high performance multilayer manufacturing and processing of all resists.


Category: PCB Fabrication Chemicals
Sub-Category: Electroless Copper

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